| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for suppressing the capacity of a capacitor which is formed when an IC chip is mounted on a circuit pattern and allowing the IC chip to be provided with high mounting reliability and to be inexpensively mounted concerning the method for manufacturing a radio wave readable data carrier using a radio wave of a wave length of≥850 MHz as a communication frequency, and to provide a board to be used for the manufacturing method, etc. <P>SOLUTION: In a process for mounting the IC chip on the board, the bump of the IC chip is pressurized onto a thermoplastic resin film, while irradiating ultrasonic wave, so as to allow the bump to be brought into contact with an electrode area by putting off the thermoplastic resin film. When the ultrasonic wave is continuously radiated in a state where the bump contacts the electrode area, the bump is joined by the ultrasonic wave with the electrode area. The thermoplastic resin film is cooled and hardened. A semiconductor bear chip main body is stuck onto the board. Consequently, the radio wave readable data carrier is efficiently manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
