| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module with low manufacture cost, which maintains a transmission characteristic by improving heat dissipation of a high frequency power amplifier. SOLUTION: Semiconductor integrated circuit elements 24 and 25 constituting the high frequency power amplifier and filter elements 3a, 4a, 3b and 4b constituting an antenna resonator are bonded to a conductor pattern on a dielectric substrate 23 in solder 30 or solder bumps 31. A thermal via conductor 50 is connected to the conductor pattern. COPYRIGHT: (C)2006,JPO&NCIPI |
