| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultra-thin chip manufacturing process capable of simplifying production facilities, reducing production cost, and processing an ultra-thin wafer without damaging it. SOLUTION: The ultra-thin chip is manufactured by sequentially undergoing a wafer alignment step of taking out a wafer 2, to which a surface protection tape is adhered on the side thereof facing the surface of a circuit for positioning it; a wafer transfer step of transferring the positioned wafer 2 to supply it on a table 10 with the side, with the circuit surface facing downward; a dicing step of laser-dicing the wafer 2 which is chucked and held on the table 10, from the back of the side facing the circuit surface; a wafer-mounting step of adhering the laser-diced wafer 2 and a dicing frame 11 on the same table 10 to integrate both into a work W; a tape-stripping step of stripping the surface protection tape adhered to the surface of the wafer 2 facing the circuit surface; and a wafer storage step of storing the wafer 2 of which surface protection tape has been stripped. COPYRIGHT: (C)2006,JPO&NCIPI |
