CIRCUIT BOARD AND ITS MANUFACTURING METHOD, SEMICONDUCTOR PACKAGE, COMPONENT-INTEGRATED MODULE, AND BOARD FOR ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a circuit board for forming lands at narrow pitches, a method for manufacturing the circuit board, a semiconductor package to be manufactured using this circuit board, a component-integrated module, and a board for electronic equipment. SOLUTION: This circuit board (100) is provided with an electrical insulating base material (101), made of one or more layers and a conductive part formed within a via hole, provided to the electrical insulating base material (101). In addition, at least either of the surfaces of the electrical insulating base material (101) at the outermost layer is provided with only the land (102). COPYRIGHT: (C)2006,JPO&NCIPI