| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer supporting member equipped with a function for cooling a wafer W by making a cooling medium flow to a conductive base, and for heating the wafer W by a heater by solving the problem that it used to be difficult to precisely and uniquely heat the temperature of the wafer W in a fixed temperature ranging from a room temperature to 100°C, since it is necessary to heat the wafer W on a placing surface while making the heat from the heater flow to the conductive base although it is possible to release heat even when the wafer W is quickly heated by a plasma or the like. SOLUTION: This wafer supporting member is provided with a holder configured by forming one main surface of a plate-shaped body as a placing face on which a wafer is placed; a heater 5 configured by embedding a heater 7 in insulating resin, forming recesses on the surface of the insulating resin, and filling resin whose composition is different from that of the insulating resin so that the recesses can be packed; and a conductive base part 10. A heater is interposed between the holder and the conductive base. COPYRIGHT: (C)2006,JPO&NCIPI |
