| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for an adhesive tape, having a good expanding property, less effect of dicing dusts to a semiconductor chip and a good cutting property, an adhesive tape, and the adhesive tape with a releasing tape. SOLUTION: This substrate used for the adhesive tape having an adhesive layer on the substrate is provided by laminating an adhesive-applied layer, a thermoplastic elastomer layer and a resin layer in this order, wherein, the thermoplastic elastomer layer consists of a resin layer containing≥70 mass % hydrogenated styrene-butadiene copolymer and the thickness of the layer is≥30 % based on the thickness of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI |
