| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical semiconductor encapsulation which is excellent in transparency and soldering resistance, and to provide an optical semiconductor device encapsulated with its cured product. SOLUTION: The epoxy resin composition for optical semiconductor encapsulation is provided which is composed, as the main components, of an epoxy resin (A) having two or more epoxy groups in one molecule, an acid anhydride curing agent (B), a curing accelerator (C), a glass particle (D), a UV absorber (E) and a mold release agent (F), and contains a cyclic nitrogen compound (G). Also provided is the optical semiconductor device characterized in that the optical semiconductor element is encapsulated using it. COPYRIGHT: (C)2006,JPO&NCIPI |
