| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board with high connection reliability and its manufacturing method, by forming a hardening body layer on the surface of the wall of a through hole before a pressing process, and by maintaining the shape of a via hole. SOLUTION: The printed circuit board excellent in the electric connectivity in a via hole 1 is provided, in such a way that the shape of the via hole 1 can be maintained stably, by forming a hardening body layer 7 consisting of thermosetting resin on the surface of the wall of a through hole 3 arranged in an electric insulating substrate 2, without the flow out of the conductive filler in a conductive paste 5 from the through hole 3, even if the thermosetting resin causes a softening flow at the time of a heat pressing process. COPYRIGHT: (C)2006,JPO&NCIPI |
