| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for housing a desiccant in which malfunctions of microelectronics/electronic circuits are not caused by electromigration. SOLUTION: In a structure according to one embodiment, a desiccant is housed in a package device and the structure includes a substrate, a first metal layer arranged in a predetermined region on the substrate, a second metal layer that defines a predetermined region, an insulator layer arranged on the first metal layer, the desiccant arranged thereon, a transparent film arranged on the desiccant and the insulator layer, surrounding the desiccant, the insulator layer, and the first metal layer, and a plurality of metal traces arranged on the transparent film. COPYRIGHT: (C)2006,JPO&NCIPI |
