LAMINATE FOR FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminate for a flexible printed circuit board which shortens a period of time until the stabilization by changing the dimension when a chip is mounted in a COF (chip on flexible printed circuit) for which the IC chip is directly mounted on a film carrier tape. SOLUTION: This laminate for the flexible printed circuit board has a structure for which a conductive layer of a copper foil or the like and an insulation layer of a polyimide or the like are laminated. The diffusion factor of the insulation layer to water is 0.4×10-13m2/s or higher under an environment at 23°C. The moisture absorption of the insulation layer is 1.5% or lower under an environment at 23°C and humidity of 50%RH. COPYRIGHT: (C)2006,JPO&NCIPI