A PROCESS OF FORMING A SOLDER MASK

摘要

The invention relates to a process of forming a solder mask on a printed circuit board comprising the steps of (a) charging powder paint particles in the presence of carrier particles (b) feeding the charged powder paint particles with carrier particles to a transporter (c) (optionally) transferring the charged powder paint particles from the transporter onto a transfer medium and (d) applying the powder paint particles to a printed circuit board to form a layer of powder paint particles.