| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device made to be high in reliability by ensuring a fatigue life of a connection part between a semiconductor package and a mounting substrate. SOLUTION: The semiconductor device comprises a semiconductor element, the mounting substrate on which the semiconductor element is mounted, and a support member for supporting the mounting substrate via a connection member. The connection member includes a first mounting substrate connection part with the mounting substrate on the first side of the semiconductor element, in a direction along the principal surface of the mounting substrate on which the semiconductor element is mounted; and a first support member connection part with the support member on a second side opposite, via the semiconductor element, to the first side. COPYRIGHT: (C)2006,JPO&NCIPI |
