| 摘要 |
PROBLEM TO BE SOLVED: To readily remove a metallic contaminant 5 taken into a carrier 2 by a metallic contamination attached to the rear of a wafer 1 by loading and unloading the wafer 1 to and from the carrier 2. SOLUTION: A replacement 4 is provided to a portion in contact with the wafer 1 of a slot 3F supporting the wafer 1. The replacement 4 is a portion holding the wafer 1. The replacement 4 is fixed to slots 3F, 3B by means of an adhesive 6, and the replacement 4 is made to be removed freely. A material having a siloxane structure or an organic polymer structure is used as the adhesive fixing the replacement 4. The adhesive 6 fixing the replacement 4 is dissolved by an acid chemical (hydrofluoric acid, for example) of a low concentration of 10% or less and the replacement 4 is removed. Instead of the replacement 4, a contamination preventing film can be laminated in the slot for preventing the metallic contaminant from coming into direct contact with the slot of the carrier. COPYRIGHT: (C)2006,JPO&NCIPI |
