Stress-compensation layers in contact arrays, and processes of making same

摘要

A stress-compensation layer is formed by pressing a solder bump into a compressible film within a mold chase. The stress-compensation layer flows against the solder bump and the compressible film such that at least a portion of the solder ball is embedded in the stress-compensation layer. The compressible film is removed to reveal at least a portion of the solder bump exposed and free of the stress-compensation layer. An article that exhibits a stress-compensation layer with a surface characteristic of the imposed flexible film is also included. A computing system that includes a stress-compensation layer with a surface characteristic of the imposed flexible film is also included.