发明名称 |
Interconnect structure for an integrated circuit and method of fabrication |
摘要 |
An interconnect structure for an integrated circuit having several levels of conductors is disclosed. Dielectric pillars for mechanical support are formed between conductors in adjacent layers at locations that do not have vias. The pillars are particularly useful with low-k ILD or air dielectric.
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申请公布号 |
US2005221604(A1) |
申请公布日期 |
2005.10.06 |
申请号 |
US20050142437 |
申请日期 |
2005.05.31 |
申请人 |
HE JUN;MAIZ JOSE;PARK HYUN-MOG |
发明人 |
HE JUN;MAIZ JOSE;PARK HYUN-MOG |
分类号 |
H01L23/522;H01L23/532;(IPC1-7):H01L21/476 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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地址 |
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