发明名称 |
Pulsed laser processing with controlled thermal and physical alterations |
摘要 |
A method for laser machining of material using a burst comprised of laser pulses. The method tailors the pulse width, pulse separation duration, wavelength and polarization of the multiple laser pulses included in a burst to maximize the positive effect of thermal and physical changes achieved by previous pulses that have impinged upon the machined material.
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申请公布号 |
US2005218122(A1) |
申请公布日期 |
2005.10.06 |
申请号 |
US20040813389 |
申请日期 |
2004.03.31 |
申请人 |
IMRA AMERICA, INC. |
发明人 |
YAMAMOTO TADASHI;HARTER DONALD J.;PATEL RAJESH S.;ARAI ALAN Y. |
分类号 |
B23K26/00;B23K26/06;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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