| 摘要 |
There is closed a flux which is designed to be used in a soldering using a lead-free and zinc-free solder containing tin as a major component and not containing lead, the soldering being adapted to be applied to a surface portion which is constituted by a copper-based metal and/or a nickel-based metal (excluding the case where the surface portion is constituted by electroless nickel plating), wherein the flux contains at least one kind of material selected from the group consisting of a copper-based metal, a nickel-based metal, an inorganic salt of copper-based metal and/or a nickel-based metal, an inorganic complex of copper-based metal and/or a nickel-based metal, and an organic complex of copper-based metal and/or a nickel-based metal (a metal complex of an organic compound where atoms of N, O and S in amine (excluding nitrogen-containing hetrocyclic compounds), imine (excluding nitrogen-containing hetrocyclic compounds), oxime, ketone, alkoxy and thioketone are coordinated with a metal). There is also closed a method of manufacturing a lead-free soldered body wherein this flux is employed.
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