| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent connection failure caused by the disconnection of a bonding wire, the contact of the bonding wires, and the like caused by the flow of the wires at the time of sealing a resin sealed semiconductor device. <P>SOLUTION: A semiconductor pellet 30 and a chip component 40 are provided on an insulating substrate 20, and are sealed with mold resin cast using a transfer mold method. The chip component 40 is arranged such that four sides of the semiconductor pellet 30 are surrounded thereby. The longitudinal direction of the chip component 40 surrounding the semiconductor pellet 30 faces a fixed direction. During resin injection, the insulating substrate 20 is set to a mold forming apparatus such that the longitudinal direction of the chip component 40 becomes substantially perpendicular to the direction of the flow of injected resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
