| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, since electrode portions of passive elements are formed of tin plating and hence are fastened to mounting lands by a brazing material in mounting the passive elements on a circuit device, interconnections cannot be crossed by a single layer which leads to the expansion of a mounting area, restrictions on reflow temperature in mounting a circuit device module on a printed board, and deteriorated reliability due to the cracking of solder after packaging. <P>SOLUTION: The electrode portions 7 of the passive elements 6 are formed of gold plating, and bonding wires 8 are directly fastened to the electrode portions. Due to this structure, a mounting density can be improved by the reduction in the number of the mounting lands and pads 3a for fastening the passive elements, realization of crossing the interconnections by a single layer, etc. Furthermore, the restriction on the temperature can be removed at the time of mounting the circuit device module on the printed board, that is, the circuit device module has to be mounted on the printed board at a melting point of solder or less. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
