| 摘要 |
PROBLEM TO BE SOLVED: To improve moisture resistance in a semiconductor device. SOLUTION: The semiconductor device is constituted of a substrate 12, a semiconductor chip 14, a chip fixing plate 16 pressing the semiconductor chip 14 in order to fix the semiconductor chip 14 to the substrate 12, and a sealing resin 18 sealing the semiconductor chip 14. In the semiconductor device 14, such a constitution can improve the moisture resistance, since no water vapor generated by heating an adhesive conventionally used for fixing the semiconductor chip 14 on the substrate 12 with the fixing plate 16 is not generated. COPYRIGHT: (C)2006,JPO&NCIPI |
