SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which contributes to a reliability improvement and a resistance reduction of a wiring structure. SOLUTION: A layer dielectric 41 including an aperture 42 is disposed on a semiconductor substrate. A wiring body layer 46 with Cu as a main component is buried in the aperture 42. A barrier film 44 is interposed between the layer dielectric 41 and the wiring body layer 46 inside the aperture 42. The barrier film 44 is mainly composed of a chemical compound of a predetermined metallic element and a constitutive element of the layer dielectric 41. COPYRIGHT: (C)2006,JPO&NCIPI