发明名称 CONDUCTIVE PASTE FOR VIA CONDUCTOR AND CERAMIC WIRING BOARD USING IT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a via conductor having excellent electrical conductivity. SOLUTION: The present invention is directed to a conductive paste for the via conductor, comprising a Cu powder having a glass layer formed on a surface, a Ni powder having a metal oxide layer formed on a surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet; a ceramic wiring board such as laminated ceramic capacitor comprising the via conductors 5, 6 formed by using the paste; and a method of manufacturing the same. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005276826(A) 申请公布日期 2005.10.06
申请号 JP20050051977 申请日期 2005.02.25
申请人 KYOCERA CORP 发明人 SATO HISASHI
分类号 H05K3/40;H01B1/00;H01B1/22;H05K3/12;H05K3/46;(IPC1-7):H01B1/00 主分类号 H05K3/40
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