| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component free from delamination and high in dimensional accuracy. SOLUTION: The method comprises a step of forming a first ceramic green sheet layer 2 on a supporting body 1, a step of forming a second ceramic green sheet layer 3 on the first ceramic green sheet layer 2 for the formation of a ceramic green sheet 4, a step of forming a conductor layer 5 on the ceramic green sheet 4, a step of laminating several ceramic green sheets 4 and of heating the laminate for the fabrication of a ceramic green sheet laminate 6, and a step of baking the ceramic green sheet laminate 6. The point of a penetrator pressing the first ceramic green sheet layer 2 is displaced by 10-100μm in the range of 35-100°C in a penetration test using a needle probe having a 1 mm-diameter needle under a load of≤0.77 N. COPYRIGHT: (C)2006,JPO&NCIPI |
