| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light receiving element and a semiconductor photodetector, in which a production cost can be lowered by making a production yield higher than in the prior art, and moreover a mounting strength is increased, thereby maintaining a high reliability. SOLUTION: The semiconductor photodetector 10 has the semiconductor light receiving element 20 and a sub-mount member 30, and the semiconductor light receiving element 20 is comprised of n electrodes 22, 23 formed on a semiconductor substrate 24, a mesa type semiconductor lamination part 25 having a p electrode 21, and a passivation film 26. The sub-mount member 30 is comprised of wiring patterns 31 to 33, a bump 34 for electrically connecting the p electrode 21 with the wiring pattern 31, and bumps 35 and 36 for electrically connecting the n electrodes 22, 23 with the wiring pattern 32, 33, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
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