| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can surely prevent the matter that mechanical teardown is generated on a bonding surface between a connection pad and a conducting bump, a conducting bump itself, etc. over long period of time, even when the connection pad becomes small and the conducting bump is formed of lead free solder, and which wiring board is excellent in reliability of mechanical and electrical connection to an external electric circuit board. SOLUTION: The wiring board 9 is provided with an insulating substrate 1 which is constituted by laminating a plurality of insulators, a wiring conductor 2 formed inside the insulating substrate 1, a plurality of the connection pads 3 which are arranged and formed on an outer peripheral part of a lower surface of the insulating substrate 1 so as to respectively protrude to a plurality of notched parts 1a formed on a side surface of the insulating substrate 1, and electrically connected to the wiring conductor 2 at the notched parts 1a, a conducting pad 4 formed in a center section of a lower surface of the insulating substrate 1, holes 5 of not penetrating which were formed on periphery of the conducting pad 4 of the lower surface of the insulating substrate 1, and conductors 6 formed on internal surfaces of the holes 5 of not penetrating. COPYRIGHT: (C)2006,JPO&NCIPI
|
