发明名称 CONDUCTIVE RESIN MOLDING AND CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin molding and a conductive resin composition which has necessary conductivity and heat shock resistance as an electromagnetic wave shield material. SOLUTION: Disclosed is the conductive resin molding such that volume resistivity after molding is≤1Ωcm and the variation rate of the volume resistivity after 200 cycles of a heat shock at -40 to 140°C to its initial value is≤10 or minus. Such a conductive resin molding is obtained by molding a conductive resin composition containing 30 to 84.99 mass% thermoplastic resin (A) containing no fluorine, a 0.01 to 20 mass% fluorine-containing polymer (B), and 15 yo 60 mass% carbon fiber (C). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005277195(A) 申请公布日期 2005.10.06
申请号 JP20040089873 申请日期 2004.03.25
申请人 MITSUBISHI RAYON CO LTD 发明人 TANAKA SEISUKE;SHIRAI YASUNORI
分类号 C08K7/04;C08L101/00;H01B1/24;H05K9/00;(IPC1-7):H05K9/00 主分类号 C08K7/04
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