| 摘要 |
PROBLEM TO BE SOLVED: To prevent the malfunction of an electronic component by easily radiating heat generated in the electronic component to prevent the electronic component from overheating. SOLUTION: In the manufacturing method of the electronic device, a heating element 3 is connected to a heat radiating body 5 through a heat conductive connecting material 4 comprising a heat conductive member 42 in a matrix member 41. The method comprises a connecting process wherein the heat radiating body 5 is bonded to the heating element 3 through the heat conductive connecting material 4 so as to be conductive thermally, the matrix material 41 removing process wherein the matrix material 41 is removed sequentially from the heat conductive connecting material 4 to leave the heat conductive member 42 between the heating element 3 and the heat radiating body 5, and a treating process wherein at least one of the heating treatment of the remaining heat conductive member 42 or the pressurizing treatment of the remaining heat conductive member 42 is effected. COPYRIGHT: (C)2006,JPO&NCIPI
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