| 发明名称 |
Semiconductor component with internal heating |
| 摘要 |
The invention involves a process for heating a semi-conductor component, as well as a semi-conductor component, whereby a device for heating the semi-conductor component is provided on the semi-conductor component.
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| 申请公布号 |
US2005218917(A1) |
申请公布日期 |
2005.10.06 |
| 申请号 |
US20050090292 |
申请日期 |
2005.03.28 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HUBER THOMAS;MENCK PEGGY;EGGERS GEORG |
| 分类号 |
G01R31/26;G01R31/28;G11C29/12;H01L21/66;H01L23/62;H01L27/105;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
| 代理机构 |
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| 主权项 |
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