TIN-BASED COATING OF ELECTRONIC COMPONENT,申请号WO2005US01999-传众专利搜索

发明名称	TIN-BASED COATING OF ELECTRONIC COMPONENT
摘要	A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
申请公布号	WO2005074026(A3)	申请公布日期	2005.10.06
申请号	WO2005US01999	申请日期	2005.01.21
申请人	ENTHONE INC.;XU, CHEN;ZHANG, YUN;FAN, CHONGLUN;KHASELEV, OSCAR;ABYS, JOSEPH, A.;WALCH, ERIC;KLEINFELD, MARLIES;ECKERT, HANS, ULLRICH	发明人	XU, CHEN;ZHANG, YUN;FAN, CHONGLUN;KHASELEV, OSCAR;ABYS, JOSEPH, A.;WALCH, ERIC;KLEINFELD, MARLIES;ECKERT, HANS, ULLRICH
分类号	C25D5/12;H01L23/495;H01R4/02;H01R13/03;H05K3/34	主分类号	C25D5/12
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