| 摘要 |
This invention provides a method of manufacturing an electronic assembly comprising the steps of: fixing a first electronic component 16 to a substrate 18 by means of an anisotropic conductive film 19, applying thermal compression to this first electronic component whereby electrical contacts formed on the component are brought into electrical contact with corresponding contacts formed on said substrate, applying solder 26 to the substrate at contact locations on the substrate where a second electronic component 24 is to be electrically connected on said substrate, and providing a thermal protective cover (10, Fig 1) over the first electronic component and performing a solder reflow process to electrically connect the second electronic component at the contact locations. The substrate may be flexible, the first component may be active (a chip) and the second passive. An LCD display may be attached by means of an anisotropic film subsequent to the second component. |
