| 摘要 |
PROBLEM TO BE SOLVED: To provide a development method by which a uniform line width is formed finally by eliminating unequal developing speeds in the surface of a wafer. SOLUTION: A film of a developing solution is formed on a wafer W by supplying the developing solution to the whole surface of the wafer W by moving a developing solution supply nozzle 70. The nozzle is formed to become longer than the diameter of the wafer W and has a plurality of developing solution supply ports 86 arranged in the longitudinal direction from one end to the other end of the wafer W while the nozzle 70 discharges the developing solution. Then standstill development is performed for a prescribed period of time, for example, 8 seconds, by keeping the wafer W in a standstill state. Then the concentration of the developing solution on the surface of the wafer W is uniformized by stirring the developing solution on the wafer W by rotating the wafer W for 2.0 seconds by means of a spin chuck 60. Thereafter, standstill development is again performed for 48 seconds. When the standstill development ends, the development ends. |
