Thermal head having adhesive layer partially disposed on heat sink and method for manufacturing such thermal head

摘要

A thermal head includes a head substrate including exothermic bodies which generate heat when electricity is supplied thereto, a common electrode connected with first ends of the exothermic bodies, and independent electrodes connected with corresponding second ends of the exothermic bodies; a printed-circuit board including driving elements for controlling the electricity supplied to the exothermic bodies; and a heat sink on which the head substrate and the printed-circuit board are attached such that an end-surface of the head substrate adjoins an end-surface of the printed-circuit board. The independent electrodes are wire-connected with the corresponding driving elements across a gap between the adjoining end-surfaces so as to define a wire-connection unit, which is sealed with resin. An adhesive layer is partially disposed between the printed-circuit board and the heat sink such that a space is provided therebetween, the space communicating with the outside of the thermal head and with the gap.