发明名称 |
Polishing apparatus |
摘要 |
The polishing apparatus (10) is capable of precisely controlling polishing pressure, correctly positioning a press plate (47) and uniformly polishing a workpiece (W). In the polishing apparatus (10), a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber (39) and pressing a main head section (24) downward; second pressing means for introducing a pressurized fluid into a second fluid chamber (50) and pressing a press plate (47) downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber (64) and pressing the workpiece (W) downward. With this structure, the workpiece (W) is held on the lower side of an elastic sheet member (63), and the lower face of the workpiece (W) can be polished by a polishing plate (14). |
申请公布号 |
EP1582293(A2) |
申请公布日期 |
2005.10.05 |
申请号 |
EP20050252049 |
申请日期 |
2005.03.31 |
申请人 |
FUJIKOSHI MACHINERY CORPORATION |
发明人 |
MIYASHITA, TADAKAZU;KISHIDA, HIROMI |
分类号 |
B24B37/005;B24B37/30;B24B37/32;B24B49/16;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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