发明名称 |
Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor |
摘要 |
A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110 . A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133 E and 133 F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133 E and 133 F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101 . The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.
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申请公布号 |
US6952049(B1) |
申请公布日期 |
2005.10.04 |
申请号 |
US20000538469 |
申请日期 |
2000.03.29 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
OGAWA KOUKI;KODERA EIJI |
分类号 |
H01G4/232;H01G4/236;H01L23/12;H01L23/13;H01L23/498;H01L23/50;H01L23/64;H01L25/00;H05K1/02;H05K1/18;H05K3/46;(IPC1-7):H01L23/053 |
主分类号 |
H01G4/232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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