THIN TYPE SEMICONDUCTOR DEVICE, MODULE STRUCTURE USING THE DEVICE AND METHOD OF MOUNTING THE DEVICE ON BOARD.

摘要

ENDS OF INNER LEADS (2A) ARE DISPOSED IN THE VICINITY OF A PERIPHERAL END OF A SEMICONDUCTOR CHIP (1) AND A PORTION OF AN INSULATING FILM TAPE (3) IS AFFIXED TO A MAIN SURFACE OF THE SEMICONDUCTOR CHIP (1) BY AN ADHESIVE (4) WHILE OTHER PORTIONS OF THE INSULATING FILM TAPE (3) ARE AFFIXED TO PORTIONS OF THE INNER LEADS (2A) BY AN ADHESIVE (4). ELECTRODE PADS (1A) PROVIDED IN THE MAIN SURFACE OF THE SEMICONDUCTOR CHIP (1) ARE ELECTRICALLY CONNECTED TO THE ENDS OF THE CORRESPONDING INNER LEADS (2A) BY BONDING WIRES (6), AND THE SEMICONDUCTOR CHIP (1), THE INNER LEADS (2A), THE ELECTRODE PADS (1A), THE INSULATING FILM TAPE (3) AND THE BONDING WIRES (6) ARE SEALED BY A RESIN MOLDING (7). A THICKNESS OF THE INSULATING FILM TAPE (3) IS SMALLER THAN A HEIGHT FROM THE MAIN SURFACE OF THE SEMICONDUCTOR CHIP (1) TO AN APEX OF THE BONDING WIRE (6). SURFACES OF THE ENDS OF THE INNER LEADS (2A) CONNECTED TO THE BONDING WIRES (6) ARE POSITIONED TO BE LOWER THAN THE MAIN SURFACE OF THE SEMICONDUCTOR CHIP (1) AND THE INNER LEADS ARE POSITIONED BETWEEN THE MAIN SURFACE AND AN OPPOSITE SURFACE OF THE SEMICONDUCTOR CHIP (1).