ADHESIVE SHEET FOR WAFER SETTING AND PROCESS FOR PRODUCING ELECTRONIC COMPONENTS

摘要

AN ADHESIVE SHEET (1) FOR WAFER SETTING (10), COMPRISING WAFER SETTING PART COMPOSED OF AN EXPANSIBLE FILM (1B) AND AN ADHESIVE LAYER (1A) FOR WAFER SETTING AND A MARGINAL PART OUTSIDE THE WAFER SETTING PART, WHEREIN THE MARGINAL PART HAS AN ANTIEXPANSIBILITY GREATER THAN THAT OF THE WAFER SETTING PART. THIS ENABLES SECURE EXPANSION IN A PROCESS FOR PRODUCING ELECTRONIC COMPONENT.