发明名称 Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
摘要 A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The antenna structure can be produced in a joint operation with the electrically conductive layer. The antenna structure is connected to a microchip, so that data can be written in or read out without contact in a wireless transponder system.
申请公布号 US2005210658(A1) 申请公布日期 2005.09.29
申请号 US20050124593 申请日期 2005.05.06
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHMID GUNTER;KLAUK HAGEN;HALIK MARCUS
分类号 B32B15/20;B65D5/42;G06K19/077;H01Q1/22;H01Q7/00;(IPC1-7):H01P11/00 主分类号 B32B15/20
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