发明名称 |
Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure |
摘要 |
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The antenna structure can be produced in a joint operation with the electrically conductive layer. The antenna structure is connected to a microchip, so that data can be written in or read out without contact in a wireless transponder system.
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申请公布号 |
US2005210658(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20050124593 |
申请日期 |
2005.05.06 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SCHMID GUNTER;KLAUK HAGEN;HALIK MARCUS |
分类号 |
B32B15/20;B65D5/42;G06K19/077;H01Q1/22;H01Q7/00;(IPC1-7):H01P11/00 |
主分类号 |
B32B15/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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