| 发明名称 |
IC die with directly bonded liquid cooling device |
| 摘要 |
An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.
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| 申请公布号 |
US2005212121(A1) |
申请公布日期 |
2005.09.29 |
| 申请号 |
US20040813187 |
申请日期 |
2004.03.29 |
| 申请人 |
RAVI KRAMADHATI V;PRASHER RAVI S;CHRYSLER GREGORY M |
发明人 |
RAVI KRAMADHATI V.;PRASHER RAVI S.;CHRYSLER GREGORY M. |
| 分类号 |
H01L23/473;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/473 |
| 代理机构 |
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代理人 |
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| 主权项 |
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