PACKAGING OF MICROELECTRONIC, OPTOELECTRONIC AND OTHER DEVICES

摘要

A chip or the like is packaged by being sealed between first and second package elements. The package elements are created by impressing dispensing a liquid polymer into a mould cavity and impressing the chip, or another object of equivalent shape, into a polymer body by hot or cold embossing. The polymer body may comprise a liquid polymer dispensed into a mould cavity, the liquid polymer being cured by heat or radiation such as UV. Multiple chips may be enclosed in a single package.