| 发明名称 |
Sensorvorrichtung |
| 摘要 |
<p>A sensor device includes a circuit chip and a sensor chip. The circuit chip has a bonding portion. The sensor chip is stacked on the bonding portion of the circuit chip. The circuit chip and the sensor chip are bonded by a film-type adhesive containing 91 ±3 weight % of polyimide with no filler.</p> |
| 申请公布号 |
DE102005008272(A1) |
申请公布日期 |
2005.09.29 |
| 申请号 |
DE20051008272 |
申请日期 |
2005.02.23 |
| 申请人 |
DENSO CORP |
发明人 |
IKEZAWA TOSHIYA;TANAKA MASAAKI |
| 分类号 |
G01P15/08;B60R21/01;C09J5/04;G01P9/04;G01P15/00;G01P15/125;H01L21/50;H01L23/18;H01L25/065;H01L31/00;(IPC1-7):H01L23/18 |
主分类号 |
G01P15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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