| 摘要 |
A probe device (100) with control position- measuring means, for inspecting electrical characteristics of an object to be inspected formed on a wafer-like substrate (W). The probe device has a prober chamber (29), a placement base (6) that is provided in the prober chamber and on which the object to be inspected is placed, a movement mechanism (16) for moving the placement base in X, Y, Z, and Theta directions, and probes (26). The probe device further has a probe card (14) provided opposite the placement base and first optical length- measuring devices (4a, 4b). The first optical length-measuring devices radiate light to a surface of the object to be inspected placed on the placement base and measure the position in the Z-axis direction of the object based on the light reflected from the object. The probe device can also have second optical length-measuring devices (5a, 5b).
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