Power module for automotive application, has molded housing surrounding semiconductor component and wire bond, and connection area left out from housing and suspended on layer

摘要

The module has a semiconductor component e.g. power MOS device, which is mounted on a copper layer (4) of a substrate (2). The component is connected with a contacting copper layer (5) provided on top side of a ceramic body (3) using a wire bond (10). A molded housing (11) made of thermosetting material surrounds the component and the bond. A connection area is left out from the housing and is freely suspended on the layer (5). An independent claim is also included for a method of manufacturing a power module.