| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid a malfunction of a semiconductor IC chip suppressing incidence of light to the chip, while securely providing a masking function to an ACF31, by controlling generation of air bubbles in the ACF31 when the semiconductor IC chip is mounted on a circuit board through the ACF31. <P>SOLUTION: The ACF31 is constituted by a particle layer 32 including conductive particles 32b, and a resin layer 33 not including the conductive particles, then the resin layer 33 is formed by a masking layer of lower flowability than the particle layer 32. As flowability of the masking layer is low, generation of the air bubbles in the masking layer is suppressed, and the ACF31 is securely provided with the masking function, when the semiconductor IC chip is mounted on the circuit board by heating and pressure bonding through the ACF31. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
