| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a wiring pattern 22 and connecting connection terminals 18, 20 of connectors 14, 16 to predetermined location of this wiring pattern 22, wherein a solder connection is unwanted, the number of operations is decreased and an operation time is reduced. SOLUTION: Conductive adhesives are printed on an inner face of a lower case 10 and the connection terminals 18, 20 of the connectors 14, 16 are mounted to a predetermined location of the conductive adhesives, which are thereafter cured, thereby forming the wiring pattern 22 of a given shape on the inner face of the lower case 10. Also, the connection terminals 18, 20 of the connectors 14, 16 are connected to the land of the wiring pattern 22. Thus, formation of a wiring pattern by the solder connection or conductive paste which utilizes a printed wiring board in the prior art can be made unwanted. COPYRIGHT: (C)2005,JPO&NCIPI
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