发明名称 CONDUCTIVE PASTE FOR INTERNAL ELECTRODE, AND LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste for internal electrode capable of preventing structural defect like crack or delamination, and a laminated ceramic electronic component. SOLUTION: The conductive paste contains nickel powder, organic vehicle, and ceramic powder. The ceramic powder contains ceramic powder A having the average grain size of 0.2 to 0.4μm, and ceramic powder B having the average grain size of 0.6 to 0.8μm, and weight ratio of the ceramic powder A against the total weight of the ceramic powder (A/(A+B)) is 0.3 to 0.7. Although the conductive paste in a patent document 1 restrains the nickel powder from contraction at sintering by using common materials of small size, the common material of small size can not form a pole structure, therefore adhesion force to a dielectric layer is weak, and generates delamination in a sintered body when reducing the temperature after sintering, and although the conductive paste in a patent document 2 improves junction strength and moisture resistant property of external electrode, by using a common material having two peaks in grain size distribution, it can not be used for the internal electrode because the grains at larger side have too large size of 2.5 to 3.0. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005267858(A) 申请公布日期 2005.09.29
申请号 JP20040073723 申请日期 2004.03.16
申请人 MURATA MFG CO LTD 发明人 IWASAKI SHIN
分类号 H01G4/12;H01B1/22;H01G4/30;(IPC1-7):H01B1/22 主分类号 H01G4/12
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