| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided pressure-sensitive adhesive sheet capable of surely fastening a brittle member, such as a wafer, to a rigid plate, without causing breakage of the brittle member when the brittle member is separated from the rigid plate after completion of a manufacturing process, regardless of whether the wafer is formed into a chip or the wafer is not formed into the chip and exists as it is, and further capable of making the brittle member separated therefrom without any problems, even when the manufacturing process is accompanied with heat generation, and to provide a transfer method using the same. SOLUTION: This double-sided pressure-sensitive adhesive sheet has a brittle member-adhering pressure-sensitive adhesive layer (A) on one of surfaces of a base material (B) and a rigid plate-adhering pressure-sensitive adhesive layer (C) on the other surface, wherein the pressure-sensitive adhesive layer (A) comprises a pressure-sensitive adhesive having a storage elastic modulus of≤0.5 MPa at 23°C, the pressure-sensitive adhesive layer (C) comprises an energy ray-curing-type pressure-sensitive adhesive which is formed out of an acrylic copolymer having energy ray-curing functional groups at its side chains and has a storage elastic modulus of≥50 MPa at 23°C measured after being cured by energy rays, and a ratioα/βof a pressure-sensitive adhesive forceαof the pressure-sensitive adhesive layer (C) measured after being cured by the energy rays to a pressure-sensitive adhesive forceβof the pressure-sensitive adhesive layer (A) is in a range of 0.002-0.5. COPYRIGHT: (C)2005,JPO&NCIPI |
