| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil with an insulating layer used in the production of a multilayer printed wiring board and capable of forming the insulating layer having high heat resistance, high rigidity and low thermal expansion and excellent in fire retardancy, and the multilayer printed wiring board using it. SOLUTION: The metal foil with the insulating layer is constituted by bonding the insulating layer which is constituted of a resin composition containing a curable resin and a nonwoven fabric formed of organic fibers, to a metal foil. The resin composition contains a cyanate resin and/or its prepolymer, an epoxy resin substantially containing no halogen atom and an inorganic filler. The multilayer printed wiring board is obtained by laminating the metal foil with the insulating layer on an inner layer circuit board to mold the same under heating and pressure. COPYRIGHT: (C)2005,JPO&NCIPI |
