MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain high heat resistance and low water absorption while suppressing a dielectric constant and a dielectric tangent to low values, to minimize a change in the size of an inner conductor layer after lamination, and to improve yield. SOLUTION: A multilayer printed circuit board is formed by laminating a plurality of fluororesin group base material layers (2), and provided with at least one conductor layer (3) in its inside. A base material layer (2) provided with an inner conductor layer (3a) and a base material layer (2) adjacent to the former base material layer (2) are stuck to each other through an adhesive layer (10) consisting of a liquid crystal polymer. The thickness of the adhesive layer (10) is set to≤50μm. The linear expansion coefficient of the liquid crystal polymer used for the adhesive layer (10) is twice or less of the linear expansion coefficient of a conductor constituting the conductive layer (3) and set to≤20×10-6/°C. COPYRIGHT: (C)2005,JPO&NCIPI