| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition, having good adhesiveness and not impairing electrode characteristics regardless of the size of chip type electronic parts, capable of uniformly forming thickness of an end face part, a side part, a corner part, etc., of an external electrode. SOLUTION: The conductive resin composition comprises metal powder, an epoxy resin, a curing agent and a solvent. In the conductive resin composition, a thixotropic ratio obtained by dividing viscosity measured in 1 rpm number of rotations of a rotational viscometer with viscosity measured in 5 rpm number of rotations of the rotational viscometer is≤1.8. A mixture containing (A) an epoxy resin component having≥900 g/eq epoxy equivalent and (B) an epoxy resin component having <900 g/eq epoxy equivalent is used as the epoxy resin and the content of the epoxy resin component (A) in the epoxy resin is≥30 wt.%. COPYRIGHT: (C)2005,JPO&NCIPI
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