| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating device and a coating method for uniformly coating the inside of a wafer surface with a resist liquid, namely a coating liquid, using a resist liquid discharge nozzle traveling on the wafer. SOLUTION: A thermocouple 30 is mounted onto the inner surface of a discharge hole 22c in the resist liquid discharge nozzle 22 for detecting the temperature of a resist liquid immediately before being discharged from the resist liquid discharge nozzle 22. The detection result of temperature by the thermocouple 30 is outputted to a main control section 32. When the temperature exceeds a tolerance, the main control section 32 calculates the optimum supply pressure of a pump 25 based on the temperature, and changes the set supply pressure of the pump 25 set to a pump control section 26 to the calculated supply pressure. As a result, even if the temperature of the resist liquid immediately before the discharge varies by the travel of the resist liquid discharge nozzle 22 and the viscosity of the resist liquid varies, a fixed amount of resist liquid is constantly discharged onto the wafer W, and the inside of the wafer surface is uniformly coated with the resist liquid. COPYRIGHT: (C)2005,JPO&NCIPI
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